? Global and China Advanced Packaging Industry Report, 2019-2025 - ResearchInChina
                                                                                                                                  Global and China Advanced Packaging Industry Report, 2019-2025
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                                                                                                                                  The global semiconductor packaging and testing market is enlarging with the prevalence of consumer electronics, automotive semiconductors and the Internet of Things (IoT), with its size edging up 2.5% year on year to $54.3 billion in 2018, of which the advanced packaging sales rose by 6.6% to approximately $25.6 billion in 2018, a figure projected to be $42.8 billion in 2025, at a CAGR of 7.6% or so between 2018 and 2025. To better meet the domestic and foreign demand for advanced packaging technology, Chinese packaging and testing companies have quickened their pace of deployments in 3D, SIP and WLCSP where they put more in research and development, which thus sends the market size of mid- and high-end packaging to $5.88 billion, or 30% of the total.

                                                                                                                                   packaging_副本.png

                                                                                                                                  Foreign companies led by ASMPacific Technology (ASMP), US-based Alltech, Germany’s TPT and Austrian vendor FK, are the main suppliers of wire bonder, a key device for semiconductor packaging, among which ASMP boasts the biggest share, or 25% of the global market in the back-end-of-line (BEOL) process. America’s Teradyne and Japan-based Advantest are the two major vendors of sorter and tester, two kinds of semiconductor testing equipment, commanding 48% and 39% of the global market, separately.

                                                                                                                                  The packaging and testing market in Mainland China has been ballooning to the second largest around the globe, as local players independently develop advanced packaging technology and acquire foreign firms, for example, Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) acquired STATS ChipPAC based in Singapore, making itself the world’s third-ranking packaging and testing plant only second to ASE Group and Amkor; Tianshui Huatian Technology Co., Ltd. acquired Flip Chip International, LLC (FCI), an American company; Tongfu Microelectronics Co., Ltd. has also been on the global top ten packaging and testing plants list after acquiring AMD’s packaging and testing subsidiary. All of which is a proof that global packaging and testing operations are gathering around Mainland China.

                                                                                                                                  Global and China Advanced Packaging Industry Report, 2019-2025 highlights the following:
                                                                                                                                  20120114.gifGlobal semiconductor industry (development course, market size, competitive pattern, packaging industry at a glance, etc.);
                                                                                                                                  20120114.gifIC packaging upstream and downstream industries: (wafer, memory, collector, PC, etc.) (market size, output & sales, competitive pattern, etc.);
                                                                                                                                  20120114.gifPackaging technology trends (SIP, 2.5D, 3D, WLCSP, etc.);
                                                                                                                                  20120114.gifAdvanced packaging industry (market size, competitive pattern, development trend, etc.);
                                                                                                                                  20120114.gif15 key foreign and Chinese vendors (ASMP, Kulicke & Soffa, Advantest, etc.) (profile, operation, R&D, manufacturing base distribution, technical characteristics, etc.).

                                                                                                                                  1. Global Semiconductor Industry
                                                                                                                                  1.1 Overview
                                                                                                                                  1.2 Supply Chain
                                                                                                                                  1.3 Semiconductor Packaging Introduction

                                                                                                                                  2. Upstream & Downstream of IC Packaging Industry
                                                                                                                                  2.1 Semiconductor Industry by Location
                                                                                                                                  2.2 Wafer Foundry Industry
                                                                                                                                  2.2.1 Market Size
                                                                                                                                  2.2.2 Competitive Pattern
                                                                                                                                  2.2.3 China’s Wafer Market
                                                                                                                                  2.3 DRAM Industry
                                                                                                                                  2.3.1 Status Quo
                                                                                                                                  2.3.2 Market Share of DRAM Vendors
                                                                                                                                  2.3.3 Market Share of Mobile DRAM Vendors
                                                                                                                                  2.4 NAND Flash
                                                                                                                                  2.5 Mobile Phone Market
                                                                                                                                  2.6 PC Market
                                                                                                                                  2.7 Tablet PC Market

                                                                                                                                  3. Packaging & Testing Technology Trend
                                                                                                                                  3.1 WIDE IO/HMC MEMORY
                                                                                                                                  3.2 Embedded Component Substrate
                                                                                                                                  3.3 Embedded Trace Substrate
                                                                                                                                  3.4 IC Packaging for Handset
                                                                                                                                  3.4.1 Status Quo
                                                                                                                                  3.4.2 PoP Packaging
                                                                                                                                  3.4.3 FOWLP
                                                                                                                                  3.5 SIP Packaging
                                                                                                                                  3.5.1 Murata
                                                                                                                                  3.5.2 USI (Taiwan)
                                                                                                                                  3.6 2.5D Packaging (SI/GLASS/ORGANIC INTERPOSER)
                                                                                                                                  3.6.1 Introduction
                                                                                                                                  3.6.2 Application
                                                                                                                                  3.6.3 2.5D Interposer Market Size
                                                                                                                                  3.6.4 Suppliers
                                                                                                                                  3.7 TSV (3D) Packaging
                                                                                                                                  3.7.1 Equipment

                                                                                                                                  4. Packaging & Testing Industry
                                                                                                                                  4.1 Market Size
                                                                                                                                  4.2 Middle-end Packaging &Testing Industry
                                                                                                                                  4.3 Market Size of Packaging Equipment
                                                                                                                                  4.4 Competitive Pattern
                                                                                                                                  4.4.1 Market Share of Packaging Equipment
                                                                                                                                  4.4.2 Ranking of Packaging Equipment Vendors

                                                                                                                                  5. Packaging Equipment Vendors
                                                                                                                                  5.1 ASM Pacific
                                                                                                                                  5.2 Kulicke & Soffa
                                                                                                                                  5.3 BESI
                                                                                                                                  5.4 Advantest
                                                                                                                                  5.5 Hitachi High-Technologies
                                                                                                                                  5.6 Teradyne
                                                                                                                                  5.7 DISCO
                                                                                                                                  5.8 TOWA
                                                                                                                                  5.9 Hanmi
                                                                                                                                  5.10 PFSA
                                                                                                                                  5.11 SUSS MicroTec
                                                                                                                                  5.12 Cohu Semiconductor Equipment Group
                                                                                                                                  5.13 Shinkawa
                                                                                                                                  5.14 Tokyo Seimitsu
                                                                                                                                  5.15 Ultratech
                                                                                                                                  Semiconductor Industry Growth versus Worldwide GDP Growth
                                                                                                                                  Revenue of Global Semiconductor Industry, 2016-2018
                                                                                                                                  Global Semiconductor Market Structure by Product, 2015-2018
                                                                                                                                  Market Size Growth of Global Semiconductor Market by Product, 2015-2018
                                                                                                                                  Semiconductor Outsourced Supply Chain
                                                                                                                                  Semiconductor Company Systems
                                                                                                                                  Semiconductor Outsourced Supply Chain Example
                                                                                                                                  Major Functions of Packaging
                                                                                                                                  Top 25 Semiconductor Sales Leaders, 2018
                                                                                                                                  Top 10 IC Manufacturers in China, 2017-2018
                                                                                                                                  Global Foundry Market Size, 2008-2018
                                                                                                                                  Global Wafer Advanced Packaging Output, 2015-2025E
                                                                                                                                  Foundry Revenue of Advanced Nodes, 2012-2018
                                                                                                                                  Global Foundry Capacity by Node, 2012-2018
                                                                                                                                  Global Foundry Revenue by Node, 2012-2018
                                                                                                                                  Global Ranking by Foundry, 2013
                                                                                                                                  Distribution of 12-inch Foundries in Mainland China
                                                                                                                                  Capacity of 12-inch Foundries in Mainland China
                                                                                                                                  Global DRAM and NAND Market Size, 2008-2018
                                                                                                                                  DRAM Supply/Demand, 2015-2018
                                                                                                                                  DRAM Tech Migration Roadmap
                                                                                                                                  DRAM CAPEX, 2013-2018
                                                                                                                                  Revenue Ranking for Branded DRAM Vendor, 2017-2018
                                                                                                                                  DRAM Market Share, 2017-2018
                                                                                                                                  Mobile DRAM Market Share, 2016-2018
                                                                                                                                  Mobile DRAM Market Share, 2018
                                                                                                                                  Revenue Ranking for Branded Mobile DRAM Vendors, 2017-2018
                                                                                                                                  Market Share of Branded NAND Flash Vendors, 2018
                                                                                                                                  NAND Supply/Demand, 2016-2018
                                                                                                                                  NAND Tech Migration Roadmap
                                                                                                                                  Average IC Cost of Mobile Phone, 2013-2018
                                                                                                                                  Global Mobile Phone Shipments, 2012-2018
                                                                                                                                  Global 3G/4G Mobile Phone Shipments by Region, 2012-2018
                                                                                                                                  Worldwide Smartphone Sales to End Users by Vendor in 2018 
                                                                                                                                  Worldwide Smartphone Sales to End Users by Operating System in 2018
                                                                                                                                  Worldwide Mobile Phone Sales to End Users by Vendor in 2018 
                                                                                                                                  Global PC-used CPU and Discrete GPU Shipments, 2012-2018
                                                                                                                                  Global Notebook Computer Shipments, 2012-2018
                                                                                                                                  Global Major Notebook Computer ODM Shipments, 2016-2018
                                                                                                                                  Global Tablet PC Shipments, 2013-2018
                                                                                                                                  Market Share of Major Tablet PC Brands, 2018
                                                                                                                                  Output of Global Tablet PC Vendors, 2017-2018
                                                                                                                                  Advantages of WIDE IO
                                                                                                                                  SK Hynix WIDE IO2 Roadmap
                                                                                                                                  HMC Architecture
                                                                                                                                  HMC Benefits
                                                                                                                                  Advantages of Embedded Passive/Active Substrate
                                                                                                                                  Embedded Component Substrate Process
                                                                                                                                  Comparison of Embedded Active & Passive Components
                                                                                                                                  Roadmap of Embedded Passive Substrate
                                                                                                                                  Structure Roadmap of Embedded Active Substrate
                                                                                                                                  FOWLP and PLP Process Comparison
                                                                                                                                  WHY Embedded Trace?
                                                                                                                                  Embedded Trace Package Features
                                                                                                                                  Apple iPad 4 LTE A1459 IC Package Type List
                                                                                                                                  iPhone X IC Package Type
                                                                                                                                  iPhone X IC BOM and Package Type
                                                                                                                                  PoP Package Development Trend
                                                                                                                                  Market Share of Major SiP Packaging Vendors, 2018
                                                                                                                                  Murata Sales and Operation Margin, FY2013-FY2018
                                                                                                                                  Murata Sales by Region, FY2013-FY2018
                                                                                                                                  Sales, New Orders and Backlog of Murata, 2013-2018
                                                                                                                                  Operating Income and Net Income of Murata, 2015-2018
                                                                                                                                  Murata Sales by Product, FY2015-FY2018
                                                                                                                                  Murata Sales by Application, FY2016-FY2018
                                                                                                                                  Revenue and Gross Margin of USI (Taiwan), 2013-2018
                                                                                                                                  Quarterly Revenue and Gross Margin of USI (Taiwan), 2016-2018
                                                                                                                                  Quarterly Revenue of USI (Taiwan) by Product, 2016-2018
                                                                                                                                  Revenue and Operating Margin of USI, 2016-2018
                                                                                                                                  Revenue of USI by Application, 2016-2018
                                                                                                                                  Output of USI by Product, 2016-2018
                                                                                                                                  2.5D Interposer Manufacturing Revenue
                                                                                                                                  Breakdown by Interposer Bulk Material, 2013-2018
                                                                                                                                  TSV Application
                                                                                                                                  TSV Equipment Suppliers
                                                                                                                                  TSV Packaging Equipment Distribution, 2013-2018
                                                                                                                                  Global Semiconductor Equipment Sales, 2015-2025E
                                                                                                                                  Global Semiconductor Packaging & Testing Equipment Sales, 2015-2025E
                                                                                                                                  Share of IC Package Added Value, 1990-2020E
                                                                                                                                  Global IC Packaging Shipment by Type, 2018
                                                                                                                                  IC Packaging & Testing Industry Sales in China, 2015-2025E
                                                                                                                                  Distribution of Global Top 10 Packaging Vendors, 2018
                                                                                                                                  Advanced Packaging Market Size in China, 2015-2025E
                                                                                                                                  Middle-End Packaging & Testing Process
                                                                                                                                  Chinese Packaging & Testing Companies Recently With More Efforts in R&D of Advanced Packaging Technology for a Faster Progress in Deployment 
                                                                                                                                  Market Size of Die Level Packaging Equipment, 2015-2018
                                                                                                                                  Semi Equipment Book-to-bill, 2015-2018
                                                                                                                                  Breakdown of Die Packaging Level Equipment by Product, 2017-2018
                                                                                                                                  Wire Bonder Vendor Market Share, 2018
                                                                                                                                  Flip-chip Bonder Vendor Market Share, 2018
                                                                                                                                  Die Bonder Vendor Market Share, 2018
                                                                                                                                  Test Handler Vendor Market Share, 2018
                                                                                                                                  Ranking of Top 16 Major Global Packaging Equipment Vendors by Revenue, 2017-2018
                                                                                                                                  Comparison between Chinese and Foreign Companies in Packaging & Testing Link

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